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Chemical content 74HC08BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC08BQ-Q100SOT762-1DHVQFN1417.94381 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298748115712601235Jiangyin, China; Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10383
PolymerResin systemProprietary0.0046319.900000.02580
subTotal0.02326100.000000.12963
DieDoped siliconSilicon (Si)7440-21-30.19236100.000001.07204
subTotal0.19236100.000001.07204
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.8028397.4700037.91185
Iron (Fe)7439-89-60.167512.400000.93350
Phosphorus (P)7723-14-00.002090.030000.01167
Zinc (Zn)7440-66-60.006980.100000.03890
subTotal6.97941100.0000038.89592
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.70606
FillerSilica -amorphous-7631-86-90.367153.490002.04610
Silica fused60676-86-08.9230784.8200049.72786
PigmentCarbon black1333-86-40.016830.160000.09380
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.63318
Epoxy resin systemProprietary0.167271.590000.93218
Phenolic resinProprietary0.236702.250001.31912
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.16922
subTotal10.52001100.0000058.62752
Pre-PlatingPure metal layerGold (Au)7440-57-50.001771.000000.00987
Nickel (Ni)7440-02-00.1612391.000000.89855
Palladium (Pd)7440-05-30.014178.000000.07899
subTotal0.17718100.000000.98741
WirePure metalCopper (Cu)7440-50-80.0498096.550000.27754
Pure metal layerGold (Au)7440-57-50.000180.350000.00101
Palladium (Pd)7440-05-30.001603.100000.00891
subTotal0.05158100.000000.28746
total17.94381100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.