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Chemical content 74HC109D-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC109D-Q100SOT109-1SO16162.42160 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935334221118712601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0155877.900000.00959
PolymerAcrylic resinProprietary0.0030415.200000.00187
Resin systemProprietary0.001386.900000.00085
subTotal0.02000100.000000.01231
DieDoped siliconSilicon (Si)7440-21-30.56694100.000000.34905
subTotal0.56694100.000000.34905
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-854.6301297.4700033.63476
Iron (Fe)7439-89-61.345162.400000.82819
Phosphorus (P)7723-14-00.016810.030000.01035
Zinc (Zn)7440-66-60.056050.100000.03451
subTotal56.04814100.0000034.50781
Mould CompoundAdditiveNon hazardousProprietary4.899614.700003.01660
FillerSilica fused60676-86-082.3551379.0000050.70454
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-86.254826.000003.85098
PigmentCarbon black1333-86-40.208490.200000.12837
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-64.169884.000002.56732
Non hazardousProprietary4.274134.100002.63150
Tetramethylbiphenyl diglycidyl ether85954-11-62.084942.000001.28366
subTotal104.24700100.0000064.18297
Pre-PlatingPure metal layerGold (Au)7440-57-50.042683.000000.02628
Nickel (Ni)7440-02-01.3132192.300000.80852
Palladium (Pd)7440-05-30.044113.100000.02715
Silver (Ag)7440-22-40.022761.600000.01402
subTotal1.42276100.000000.87597
WirePure metalCopper (Cu)7440-50-80.11676100.000000.07189
subTotal0.11676100.000000.07189
total162.42160100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.