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Chemical content 74HC10PW

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Type numberPackagePackage descriptionTotal product weight
74HC10PWSOT402-1TSSOP1451.84251 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9351862901181512601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0311677.900000.06011
PolymerAcrylic resinProprietary0.0060815.200000.01173
Resin systemProprietary0.002766.900000.00532
subTotal0.04000100.000000.07716
DieDoped siliconSilicon (Si)7440-21-30.20320100.000000.39195
subTotal0.20320100.000000.39195
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0456497.4700036.73749
Iron (Fe)7439-89-60.468962.400000.90459
Phosphorus (P)7723-14-00.005860.030000.01131
Zinc (Zn)7440-66-60.019540.100000.03769
subTotal19.54000100.0000037.69108
Mould CompoundAdditiveNon hazardousProprietary1.488964.700002.87208
FillerSilica fused60676-86-025.0272079.0000048.27544
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.900806.000003.66649
PigmentCarbon black1333-86-40.063360.200000.12222
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.267204.000002.44433
Non hazardousProprietary1.298884.100002.50543
Tetramethylbiphenyl diglycidyl ether85954-11-60.633602.000001.22216
subTotal31.68000100.0000061.10815
Pre-PlatingPure metal layerGold (Au)7440-57-50.002901.000000.00559
Nickel (Ni)7440-02-00.2813097.000000.54260
Palladium (Pd)7440-05-30.005802.000000.01119
subTotal0.29000100.000000.55938
WirePure metalCopper (Cu)7440-50-80.08931100.000000.17227
subTotal0.08931100.000000.17227
total51.84251100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.