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Chemical content 74HC126PW

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Type numberPackagePackage descriptionTotal product weight
74HC126PWSOT402-1TSSOP1452.21973 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9351835601181512601235Shanghai, China; Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0311677.900000.05967
PolymerAcrylic resinProprietary0.0060815.200000.01164
Resin systemProprietary0.002766.900000.00529
subTotal0.04000100.000000.07660
DieDoped siliconSilicon (Si)7440-21-30.59176100.000001.13321
subTotal0.59176100.000001.13321
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0456497.4700036.47211
Iron (Fe)7439-89-60.468962.400000.89805
Phosphorus (P)7723-14-00.005860.030000.01123
Zinc (Zn)7440-66-60.019540.100000.03742
subTotal19.54000100.0000037.41881
Mould CompoundFillerSilica -amorphous-7631-86-90.190080.600000.36400
Silica fused60676-86-024.8149478.3300047.52025
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.932486.100003.70067
PigmentCarbon black1333-86-40.063360.200000.12133
PolymerEpoxy resin systemProprietary2.807488.862005.37629
Phenolic resinProprietary1.871655.908003.58419
subTotal31.68000100.0000060.66673
Pre-PlatingPure metal layerGold (Au)7440-57-50.002901.000000.00555
Nickel (Ni)7440-02-00.2813097.000000.53869
Palladium (Pd)7440-05-30.005802.000000.01111
subTotal0.29000100.000000.55535
WirePure metalCopper (Cu)7440-50-80.07797100.000000.14931
subTotal0.07797100.000000.14931
total52.21973100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.