Chemical content 74HC138PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC138PW-Q100SOT403-1TSSOP1660.44447 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352987441181012601235Bangkok, Thailand; Shanghai, China; Nijmegen, Netherlands; Suzhou, China; Jiangyin, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21909
PolymerAcrylic resinProprietary0.0258415.200000.04275
Resin systemProprietary0.011736.900000.01941
DieDoped siliconSilicon (Si)7440-21-30.24383100.000000.40340
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.95193
Iron (Fe)7439-89-60.475552.400000.78675
Phosphorus (P)7723-14-00.005940.030000.00983
Zinc (Zn)7440-66-60.019810.100000.03278
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.39309
Silica fused60676-86-031.0186878.3300051.31765
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100003.99640
PigmentCarbon black1333-86-40.079200.200000.13103
PolymerEpoxy resin systemProprietary3.509358.862005.80591
Phenolic resinProprietary2.339575.908003.87061
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02496
Nickel (Ni)7440-02-00.4642592.300000.76806
Palladium (Pd)7440-05-30.015593.100000.02580
Silver (Ag)7440-22-40.008051.600000.01331
WirePure metalCopper (Cu)7440-50-80.11318100.000000.18725
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.