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Chemical content 74HC157D

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Type numberPackagePackage descriptionTotal product weight
74HC157DSOT109-1SO16137.47345 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9337137406531312601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1311577.900000.09540
PolymerAcrylic resinProprietary0.0255915.200000.01862
Resin systemProprietary0.011626.900000.00845
subTotal0.16836100.000000.12247
DieDoped siliconSilicon (Si)7440-21-30.32683100.000000.23774
subTotal0.32683100.000000.23774
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-848.6504297.4700035.38895
Iron (Fe)7439-89-61.197922.400000.87138
Phosphorus (P)7723-14-00.014970.030000.01089
Zinc (Zn)7440-66-60.049910.100000.03631
subTotal49.91322100.0000036.30753
Mould CompoundAdditiveNon hazardousProprietary4.026124.700002.92865
FillerSilica fused60676-86-067.6730779.0000049.22629
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.139736.000003.73871
PigmentCarbon black1333-86-40.171320.200000.12462
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.426484.000002.49247
Non hazardousProprietary3.512154.100002.55478
Tetramethylbiphenyl diglycidyl ether85954-11-61.713242.000001.24624
subTotal85.66212100.0000062.31176
Pre-PlatingPure metal layerGold (Au)7440-57-50.012791.000000.00931
Nickel (Ni)7440-02-01.2408897.000000.90263
Palladium (Pd)7440-05-30.025592.000000.01861
subTotal1.27926100.000000.93055
WirePure metalCopper (Cu)7440-50-80.12366100.000000.08996
subTotal0.12366100.000000.08996
total137.47345100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.