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Chemical content 74HC161D

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Type numberPackagePackage descriptionTotal product weight
74HC161DSOT109-1SO16142.90123 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9337145206531312601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-42.0025080.100001.40132
PolymerResin systemProprietary0.4975019.900000.34814
subTotal2.50000100.000001.74946
DieDoped siliconSilicon (Si)7440-21-30.99141100.000000.69377
subTotal0.99141100.000000.69377
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-869.2037097.4700048.42764
Iron (Fe)7439-89-61.704002.400001.19243
Phosphorus (P)7723-14-00.021300.030000.01491
Zinc (Zn)7440-66-60.071000.100000.04968
subTotal71.00000100.0000049.68466
Mould CompoundAdditiveNon hazardousProprietary3.196004.700002.23651
FillerSilica fused60676-86-053.7200079.0000037.59240
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.080006.000002.85512
PigmentCarbon black1333-86-40.136000.200000.09517
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.720004.000001.90341
Non hazardousProprietary2.788004.100001.95100
Tetramethylbiphenyl diglycidyl ether85954-11-61.360002.000000.95171
subTotal68.00000100.0000047.58532
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00210
Nickel (Ni)7440-02-00.2910097.000000.20364
Palladium (Pd)7440-05-30.006002.000000.00420
subTotal0.30000100.000000.20994
WirePure metalCopper (Cu)7440-50-80.10982100.000000.07685
subTotal0.10982100.000000.07685
total142.90123100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.