Chemical content 74HC173D-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC173D-Q100SOT109-1SO16163.01450 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935691581118312601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0155877.900000.00956
PolymerAcrylic resinProprietary0.0030415.200000.00186
Resin systemProprietary0.001386.900000.00085
DieDoped siliconSilicon (Si)7440-21-31.17613100.000000.72149
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-854.6301297.4700033.51243
Iron (Fe)7439-89-61.345162.400000.82518
Phosphorus (P)7723-14-00.016810.030000.01031
Zinc (Zn)7440-66-60.056050.100000.03438
Mould CompoundFillerSilica -amorphous-7631-86-90.625480.600000.38370
Silica fused60676-86-081.6566878.3300050.09166
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-86.359076.100003.90092
PigmentCarbon black1333-86-40.208490.200000.12790
PolymerEpoxy resin systemProprietary9.238378.862005.66721
Phenolic resinProprietary6.158915.908003.77814
Pre-PlatingPure metal layerGold (Au)7440-57-50.042683.000000.02618
Nickel (Ni)7440-02-01.3132192.300000.80558
Palladium (Pd)7440-05-30.044113.100000.02706
Silver (Ag)7440-22-40.022761.600000.01396
WirePure metalCopper (Cu)7440-50-80.10048100.000000.06164
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.