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Chemical content 74HC175D-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC175D-Q100SOT109-1SO16162.71481 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300783118512601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0155877.900000.00958
PolymerAcrylic resinProprietary0.0030415.200000.00187
Resin systemProprietary0.001386.900000.00085
subTotal0.02000100.000000.01230
DieDoped siliconSilicon (Si)7440-21-30.87047100.000000.53497
subTotal0.87047100.000000.53497
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-854.6301297.4700033.57415
Iron (Fe)7439-89-61.345162.400000.82670
Phosphorus (P)7723-14-00.016810.030000.01033
Zinc (Zn)7440-66-60.056050.100000.03445
subTotal56.04814100.0000034.44563
Mould CompoundAdditiveNon hazardousProprietary4.899614.700003.01116
FillerSilica fused60676-86-082.3551379.0000050.61317
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-86.254826.000003.84404
PigmentCarbon black1333-86-40.208490.200000.12813
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-64.169884.000002.56269
Non hazardousProprietary4.274134.100002.62676
Tetramethylbiphenyl diglycidyl ether85954-11-62.084942.000001.28135
subTotal104.24700100.0000064.06730
Pre-PlatingPure metal layerGold (Au)7440-57-50.042683.000000.02623
Nickel (Ni)7440-02-01.3132192.300000.80706
Palladium (Pd)7440-05-30.044113.100000.02711
Silver (Ag)7440-22-40.022761.600000.01399
subTotal1.42276100.000000.87439
WirePure metalCopper (Cu)7440-50-80.10644100.000000.06541
subTotal0.10644100.000000.06541
total162.71481100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.