Chemical content 74HC175D-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC175D-Q100SOT109-1SO16162.71481 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9353007831185126030 s123520 s3Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0155877.900000.00958
PolymerAcrylic resinProprietary0.0030415.200000.00187
Resin systemProprietary0.001386.900000.00085
DieDoped siliconSilicon (Si)7440-21-30.87047100.000000.53497
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-854.6301297.4700033.57415
Iron (Fe)7439-89-61.345162.400000.82670
Phosphorus (P)7723-14-00.016810.030000.01033
Zinc (Zn)7440-66-60.056050.100000.03445
Mould CompoundFillerSilica -amorphous-7631-86-90.625480.600000.38440
Silica fused60676-86-081.6566878.3300050.18392
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-86.359076.100003.90811
PigmentCarbon black1333-86-40.208490.200000.12813
PolymerEpoxy resin systemProprietary9.238378.862005.67764
Phenolic resinProprietary6.158915.908003.78510
Pre-PlatingPure metal layerGold (Au)7440-57-50.042683.000000.02623
Nickel (Ni)7440-02-01.3132192.300000.80706
Palladium (Pd)7440-05-30.044113.100000.02711
Silver (Ag)7440-22-40.022761.600000.01399
WirePure metalCopper (Cu)7440-50-80.10644100.000000.06541
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.