Chemical content 74HC175PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC175PW-Q100SOT403-1TSSOP1661.05005 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9353007841185126030 s123520 s3Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21692
PolymerAcrylic resinProprietary0.0258415.200000.04233
Resin systemProprietary0.011736.900000.01921
DieDoped siliconSilicon (Si)7440-21-30.87047100.000001.42584
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.63498
Iron (Fe)7439-89-60.475552.400000.77895
Phosphorus (P)7723-14-00.005940.030000.00974
Zinc (Zn)7440-66-60.019810.100000.03246
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.38919
Silica fused60676-86-031.0186878.3300050.80861
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100003.95675
PigmentCarbon black1333-86-40.079200.200000.12973
PolymerEpoxy resin systemProprietary3.509358.862005.74832
Phenolic resinProprietary2.339575.908003.83221
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02472
Nickel (Ni)7440-02-00.4642592.300000.76044
Palladium (Pd)7440-05-30.015593.100000.02554
Silver (Ag)7440-22-40.008051.600000.01318
WirePure metalCopper (Cu)7440-50-80.09212100.000000.15089
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.