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Chemical content 74HC175PW

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Type numberPackagePackage descriptionTotal product weight
74HC175PWSOT403-1TSSOP1653.50259 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9351745601181312601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1168577.900000.21840
PolymerAcrylic resinProprietary0.0228015.200000.04261
Resin systemProprietary0.010356.900000.01934
subTotal0.15000100.000000.28035
DieDoped siliconSilicon (Si)7440-21-30.87047100.000001.62697
subTotal0.87047100.000001.62697
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.8936397.4700037.18255
Iron (Fe)7439-89-60.489842.400000.91554
Phosphorus (P)7723-14-00.006120.030000.01144
Zinc (Zn)7440-66-60.020410.100000.03815
subTotal20.41000100.0000038.14768
Mould CompoundAdditiveNon hazardousProprietary1.488964.700002.78297
FillerSilica fused60676-86-025.0272079.0000046.77755
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.900806.000003.55273
PigmentCarbon black1333-86-40.063360.200000.11842
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.267204.000002.36848
Non hazardousProprietary1.298884.100002.42770
Tetramethylbiphenyl diglycidyl ether85954-11-60.633602.000001.18424
subTotal31.68000100.0000059.21209
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00561
Nickel (Ni)7440-02-00.2910097.000000.54390
Palladium (Pd)7440-05-30.006002.000000.01121
subTotal0.30000100.000000.56072
WirePure metalCopper (Cu)7440-50-80.09212100.000000.17218
subTotal0.09212100.000000.17218
total53.50259100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.