Chemical content 74HC245D

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Type numberPackagePackage descriptionTotal product weight
74HC245DSOT163-1SO20511.82696 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9337135806531812601235Hsin-chu, Taiwan; Nijmegen, Netherlands; Shanghai, China; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-410.4130080.100002.03448
PolymerResin systemProprietary2.5870019.900000.50544
DieDoped siliconSilicon (Si)7440-21-30.48091100.000000.09396
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-8151.0785097.4700029.51750
Iron (Fe)7439-89-63.720002.400000.72681
Phosphorus (P)7723-14-00.046500.030000.00909
Zinc (Zn)7440-66-60.155000.100000.03028
Mould CompoundAdditiveNon hazardousProprietary15.980004.700003.12215
FillerSilica fused60676-86-0268.6000079.0000052.47867
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-820.400006.000003.98572
PigmentCarbon black1333-86-40.680000.200000.13286
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-613.600004.000002.65715
Non hazardousProprietary13.940004.100002.72358
Tetramethylbiphenyl diglycidyl ether85954-11-66.800002.000001.32857
Pre-PlatingPure metal layerGold (Au)7440-57-50.032001.000000.00625
Nickel (Ni)7440-02-03.1040097.000000.60645
Palladium (Pd)7440-05-30.064002.000000.01250
WirePure metalCopper (Cu)7440-50-80.14605100.000000.02853
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.