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Chemical content 74HC251D-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC251D-Q100SOT109-1SO16162.67652 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935301182118812601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0155877.900000.00958
PolymerAcrylic resinProprietary0.0030415.200000.00187
Resin systemProprietary0.001386.900000.00085
subTotal0.02000100.000000.01230
DieDoped siliconSilicon (Si)7440-21-30.83072100.000000.51066
subTotal0.83072100.000000.51066
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-854.6301297.4700033.58206
Iron (Fe)7439-89-61.345162.400000.82689
Phosphorus (P)7723-14-00.016810.030000.01034
Zinc (Zn)7440-66-60.056050.100000.03445
subTotal56.04814100.0000034.45374
Mould CompoundAdditiveNon hazardousProprietary4.899614.700003.01187
FillerSilica fused60676-86-082.3551379.0000050.62509
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-86.254826.000003.84494
PigmentCarbon black1333-86-40.208490.200000.12816
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-64.169884.000002.56330
Non hazardousProprietary4.274134.100002.62738
Tetramethylbiphenyl diglycidyl ether85954-11-62.084942.000001.28165
subTotal104.24700100.0000064.08239
Pre-PlatingPure metal layerGold (Au)7440-57-50.042683.000000.02624
Nickel (Ni)7440-02-01.3132192.300000.80725
Palladium (Pd)7440-05-30.044113.100000.02711
Silver (Ag)7440-22-40.022761.600000.01399
subTotal1.42276100.000000.87459
WirePure metalCopper (Cu)7440-50-80.10790100.000000.06633
subTotal0.10790100.000000.06633
total162.67652100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.