Chemical content 74HC253D-Q100

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Type number	Package	Package description	Total product weight
74HC253D-Q100	SOT109-1	SO16	162.73658 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
935298818118	6	1	260		1	235			Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Adhesive	Filler	Silver (Ag)	7440-22-4	0.01558	77.90000	0.00957
	Polymer	Acrylic resin	Proprietary	0.00304	15.20000	0.00187
		Resin system	Proprietary	0.00138	6.90000	0.00085
		subTotal		0.02000	100.00000	0.01229

Die	Doped silicon	Silicon (Si)	7440-21-3	0.89077	100.00000	0.54737
		subTotal		0.89077	100.00000	0.54737

Lead Frame Material	Copper alloy	Copper (Cu)	7440-50-8	54.63012	97.47000	33.56966
		Iron (Fe)	7439-89-6	1.34516	2.40000	0.82658
		Phosphorus (P)	7723-14-0	0.01681	0.03000	0.01033
		Zinc (Zn)	7440-66-6	0.05605	0.10000	0.03444
		subTotal		56.04814	100.00000	34.44101

Mould Compound	Additive	Non hazardous	Proprietary	4.89961	4.70000	3.01076
	Filler	Silica fused	60676-86-0	82.35513	79.00000	50.60640
	Flame retardant	Magnesium Hydroxide (Mg(OH)2)	1309-42-8	6.25482	6.00000	3.84352
	Pigment	Carbon black	1333-86-4	0.20849	0.20000	0.12812
	Polymer	1,4-Bis(methoxymethyl)benzene/phenol copolymer	26834-02-6	4.16988	4.00000	2.56235
		Non hazardous	Proprietary	4.27413	4.10000	2.62641
		Tetramethylbiphenyl diglycidyl ether	85954-11-6	2.08494	2.00000	1.28117
		subTotal		104.24700	100.00000	64.05873

Pre-Plating	Pure metal layer	Gold (Au)	7440-57-5	0.04268	3.00000	0.02623
		Nickel (Ni)	7440-02-0	1.31321	92.30000	0.80695
		Palladium (Pd)	7440-05-3	0.04411	3.10000	0.02710
		Silver (Ag)	7440-22-4	0.02276	1.60000	0.01399
		subTotal		1.42276	100.00000	0.87427

Wire	Pure metal	Copper (Cu)	7440-50-8	0.10791	100.00000	0.06631
		subTotal		0.10791	100.00000	0.06631

		total		162.73658	100.00000	100.00000

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.