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Chemical content 74HC27BQ

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Type numberPackagePackage descriptionTotal product weight
74HC27BQSOT762-1DHVQFN1418.01677 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352836781151312601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10341
PolymerResin systemProprietary0.0046319.900000.02569
subTotal0.02326100.000000.12910
DieDoped siliconSilicon (Si)7440-21-30.26487100.000001.47015
subTotal0.26487100.000001.47015
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.8029797.4700037.75911
Iron (Fe)7439-89-60.167512.400000.92974
Phosphorus (P)7723-14-00.002090.030000.01162
Zinc (Zn)7440-66-60.006980.100000.03874
subTotal6.97956100.0000038.73921
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.69915
FillerSilica -amorphous-7631-86-90.367153.490002.03781
Silica fused60676-86-08.9230684.8200049.52644
PigmentCarbon black1333-86-40.016830.160000.09342
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.63061
Epoxy resin systemProprietary0.167271.590000.92840
Phenolic resinProprietary0.236702.250001.31378
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.16043
subTotal10.52000100.0000058.39004
Pre-PlatingPure metal layerGold (Au)7440-57-50.001771.000000.00983
Nickel (Ni)7440-02-00.1612391.000000.89489
Palladium (Pd)7440-05-30.014178.000000.07867
subTotal0.17718100.000000.98339
WirePure metalCopper (Cu)7440-50-80.0501196.550000.27815
Pure metal layerGold (Au)7440-57-50.000180.350000.00101
Palladium (Pd)7440-05-30.001613.100000.00893
subTotal0.05190100.000000.28809
total18.01677100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.