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Chemical content 74HC2GU04GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC2GU04GW-Q100SOT363-2SC-885.74557 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935304871125712601235Seremban, Malaysia; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0073675.000000.12806
PolymerResin systemProprietary0.0024525.000000.04269
subTotal0.00981100.000000.17075
DieDoped siliconSilicon (Si)7440-21-30.09611100.000001.67281
subTotal0.09611100.000001.67281
Lead FrameCopper alloyCopper (Cu)7440-50-82.0433296.8400035.56347
Iron (Fe)7439-89-60.048742.310000.84832
Lead (Pb)7439-92-10.000210.010000.00367
Phosphorus (P)7723-14-00.001480.070000.02571
Zinc (Zn)7440-66-60.002530.120000.04407
Pure metal layerSilver (Ag)7440-22-40.013720.650000.23871
subTotal2.11000100.0000036.72395
Mould CompoundFillerSilica -amorphous-7631-86-90.4396014.000007.65111
Silica fused60676-86-02.2159070.5700038.56707
PigmentCarbon black1333-86-40.006280.200000.10930
PolymerEpoxy resin systemProprietary0.4782215.230008.32332
subTotal3.14000100.0000054.65080
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00019
Bismuth (Bi)7440-69-90.000000.001000.00006
Copper (Cu)7440-50-80.000000.001000.00006
Lead (Pb)7439-92-10.000020.005000.00032
Tin solderTin (Sn)7440-31-50.3699699.990006.43910
subTotal0.37000100.000006.43973
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0196499.990000.34188
subTotal0.01964100.000000.34191
total5.74557100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.