Chemical content 74HC367D

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Type numberPackagePackage descriptionTotal product weight
74HC367DSOT109-1SO16143.95842 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9337146906531212601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0233777.900000.01623
PolymerAcrylic resinProprietary0.0045615.200000.00317
Resin systemProprietary0.002076.900000.00144
DieDoped siliconSilicon (Si)7440-21-31.31506100.000000.91350
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-836.7218297.4700025.50863
Iron (Fe)7439-89-60.904202.400000.62810
Phosphorus (P)7723-14-00.011300.030000.00785
Zinc (Zn)7440-66-60.037680.100000.02617
Mould CompoundFillerSilica -amorphous-7631-86-90.625620.600000.43458
Silica fused60676-86-081.6746978.3300056.73492
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-86.360476.100004.41827
PigmentCarbon black1333-86-40.208540.200000.14486
PolymerEpoxy resin systemProprietary9.240418.862006.41880
Phenolic resinProprietary6.160275.908004.27920
Pre-PlatingPure metal layerGold (Au)7440-57-50.005651.000000.00392
Nickel (Ni)7440-02-00.5480597.000000.38070
Palladium (Pd)7440-05-30.011302.000000.00785
WirePure metalCopper (Cu)7440-50-80.10336100.000000.07180
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.