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Chemical content 74HC40103PW

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Type numberPackagePackage descriptionTotal product weight
74HC40103PWSOT403-1TSSOP1663.31888 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9351896201181212601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.2804477.900000.44290
PolymerAcrylic resinProprietary0.0547215.200000.08642
Resin systemProprietary0.024846.900000.03923
subTotal0.36000100.000000.56855
DieDoped siliconSilicon (Si)7440-21-32.71488100.000004.28763
subTotal2.71488100.000004.28763
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-821.6773397.4700034.23517
Iron (Fe)7439-89-60.533762.400000.84297
Phosphorus (P)7723-14-00.006670.030000.01054
Zinc (Zn)7440-66-60.022240.100000.03512
subTotal22.24000100.0000035.12380
Mould CompoundAdditiveNon hazardousProprietary1.771904.700002.79838
FillerSilica fused60676-86-029.7830079.0000047.03652
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.262006.000003.57239
PigmentCarbon black1333-86-40.075400.200000.11908
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.508004.000002.38160
Non hazardousProprietary1.545704.100002.44114
Tetramethylbiphenyl diglycidyl ether85954-11-60.754002.000001.19080
subTotal37.70000100.0000059.53991
Pre-PlatingPure metal layerGold (Au)7440-57-50.009033.000000.01426
Nickel (Ni)7440-02-00.2778292.300000.43877
Palladium (Pd)7440-05-30.009333.100000.01474
Silver (Ag)7440-22-40.004821.600000.00761
subTotal0.30100100.000000.47538
WirePure metalCopper (Cu)7440-50-80.00300100.000000.00474
subTotal0.00300100.000000.00474
total63.31888100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.