Chemical content 74HC4017BQ

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Type numberPackagePackage descriptionTotal product weight
74HC4017BQSOT763-1DHVQFN1621.47670 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352853571151012601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001001.000000.00464
FillerSilver (Ag)7440-22-40.0747675.000000.34810
PolymerAcrylic resinProprietary0.005986.000000.02785
Resin systemProprietary0.0179418.000000.08354
DieDoped siliconSilicon (Si)7440-21-30.41905100.000001.95119
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700037.45257
Iron (Fe)7439-89-60.198062.400000.92219
Phosphorus (P)7723-14-00.002480.030000.01153
Zinc (Zn)7440-66-60.008250.100000.03842
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.68536
FillerSilica -amorphous-7631-86-90.434103.490002.02127
Silica fused60676-86-010.5503084.8200049.12441
PigmentCarbon black1333-86-40.019900.160000.09267
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.62549
Epoxy resin systemProprietary0.197771.590000.92087
Phenolic resinProprietary0.279872.250001.30311
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.14289
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00975
Nickel (Ni)7440-02-00.1906391.000000.88760
Palladium (Pd)7440-05-30.016768.000000.07803
WirePure metalCopper (Cu)7440-50-80.0556896.550000.25925
Pure metal layerGold (Au)7440-57-50.000200.350000.00094
Palladium (Pd)7440-05-30.001793.100000.00832
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.