Chemical content 74HC4017D

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Type numberPackagePackage descriptionTotal product weight
74HC4017DSOT109-1SO16143.07840 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9337147606531012601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0233777.900000.01633
PolymerAcrylic resinProprietary0.0045615.200000.00319
Resin systemProprietary0.002076.900000.00145
DieDoped siliconSilicon (Si)7440-21-30.41905100.000000.29288
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-836.7218297.4700025.66552
Iron (Fe)7439-89-60.904202.400000.63196
Phosphorus (P)7723-14-00.011300.030000.00790
Zinc (Zn)7440-66-60.037680.100000.02633
Mould CompoundFillerSilica -amorphous-7631-86-90.625620.600000.43726
Silica fused60676-86-081.6746978.3300057.08387
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-86.360476.100004.44544
PigmentCarbon black1333-86-40.208540.200000.14575
PolymerEpoxy resin systemProprietary9.240418.862006.45828
Phenolic resinProprietary6.160275.908004.30552
Pre-PlatingPure metal layerGold (Au)7440-57-50.005651.000000.00395
Nickel (Ni)7440-02-00.5480597.000000.38304
Palladium (Pd)7440-05-30.011302.000000.00790
WirePure metalCopper (Cu)7440-50-80.11935100.000000.08342
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.