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Chemical content 74HC4020BQ

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Type numberPackagePackage descriptionTotal product weight
74HC4020BQSOT763-1DHVQFN1621.80558 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352907841151012601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.36616
PolymerResin systemProprietary0.0198419.900000.09097
subTotal0.09968100.000000.45713
DieDoped siliconSilicon (Si)7440-21-30.75442100.000003.45975
subTotal0.75442100.000003.45975
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700036.88769
Iron (Fe)7439-89-60.198062.400000.90828
Phosphorus (P)7723-14-00.002480.030000.01135
Zinc (Zn)7440-66-60.008250.100000.03785
subTotal8.25236100.0000037.84517
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.65994
FillerSilica -amorphous-7631-86-90.434103.490001.99079
Silica fused60676-86-010.5503084.8200048.38350
PigmentCarbon black1333-86-40.019900.160000.09127
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.61606
Epoxy resin systemProprietary0.197771.590000.90698
Phenolic resinProprietary0.279872.250001.28346
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.11057
subTotal12.43846100.0000057.04257
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00961
Nickel (Ni)7440-02-00.1906391.000000.87421
Palladium (Pd)7440-05-30.016768.000000.07685
subTotal0.20948100.000000.96067
WirePure metalCopper (Cu)7440-50-80.0494296.550000.22663
Pure metal layerGold (Au)7440-57-50.000180.350000.00082
Palladium (Pd)7440-05-30.001593.100000.00728
subTotal0.05118100.000000.23473
total21.80558100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.