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Chemical content 74HC4051BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC4051BQ-Q100SOT763-1DHVQFN1621.90191 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352984461151012601235Suzhou, China; Bangkok, Thailand; Jiangyin, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.36455
PolymerResin systemProprietary0.0198419.900000.09057
subTotal0.09968100.000000.45512
DieDoped siliconSilicon (Si)7440-21-30.58076100.000002.65166
subTotal0.58076100.000002.65166
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.9746797.4700036.41086
Iron (Fe)7439-89-60.196362.400000.89654
Phosphorus (P)7723-14-00.002450.030000.01121
Zinc (Zn)7440-66-60.008180.100000.03736
subTotal8.18167100.0000037.35597
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.65264
FillerSilica -amorphous-7631-86-90.434103.490001.98203
Silica fused60676-86-010.5503184.8200048.17073
PigmentCarbon black1333-86-40.019900.160000.09087
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.61335
Epoxy resin systemProprietary0.197771.590000.90299
Phenolic resinProprietary0.279872.250001.27781
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.10129
subTotal12.43847100.0000056.79171
Pre-PlatingPure metal layerGold (Au)7440-57-50.016373.000000.07472
Nickel (Ni)7440-02-00.5035192.300002.29891
Palladium (Pd)7440-05-30.016913.100000.07721
Silver (Ag)7440-22-40.008731.600000.03985
subTotal0.54551100.000002.49069
WirePure metalCopper (Cu)7440-50-80.0538996.550000.24604
Pure metal layerGold (Au)7440-57-50.000200.350000.00089
Palladium (Pd)7440-05-30.001733.100000.00790
subTotal0.05581100.000000.25483
total21.90191100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.