Chemical content 74HC4051BQ

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Type numberPackagePackage descriptionTotal product weight
74HC4051BQSOT763-1DHVQFN1621.63850 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352736931152112601235Jiangyin, China; Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.36899
PolymerResin systemProprietary0.0198419.900000.09167
DieDoped siliconSilicon (Si)7440-21-30.58076100.000002.68394
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700037.17252
Iron (Fe)7439-89-60.198062.400000.91530
Phosphorus (P)7723-14-00.002480.030000.01144
Zinc (Zn)7440-66-60.008250.100000.03814
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.67276
FillerSilica -amorphous-7631-86-90.434103.490002.00616
Silica fused60676-86-010.5503084.8200048.75708
PigmentCarbon black1333-86-40.019900.160000.09197
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.62082
Epoxy resin systemProprietary0.197771.590000.91398
Phenolic resinProprietary0.279872.250001.29337
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.12687
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00968
Nickel (Ni)7440-02-00.1906391.000000.88096
Palladium (Pd)7440-05-30.016768.000000.07745
WirePure metalCopper (Cu)7440-50-80.0557796.550000.25772
Pure metal layerGold (Au)7440-57-50.000200.350000.00093
Palladium (Pd)7440-05-30.001793.100000.00827
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.