Chemical content 74HC4051PW

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Type numberPackagePackage descriptionTotal product weight
74HC4051PWSOT403-1TSSOP1653.22292 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9351874801182112601235Jiangyin, China; Shanghai, China; Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1168577.900000.21955
PolymerAcrylic resinProprietary0.0228015.200000.04284
Resin systemProprietary0.010356.900000.01945
DieDoped siliconSilicon (Si)7440-21-30.58076100.000001.09119
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.8936397.4700037.37793
Iron (Fe)7439-89-60.489842.400000.92036
Phosphorus (P)7723-14-00.006120.030000.01150
Zinc (Zn)7440-66-60.020410.100000.03835
Mould CompoundAdditiveNon hazardousProprietary1.488964.700002.79759
FillerSilica fused60676-86-025.0272079.0000047.02335
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.900806.000003.57139
PigmentCarbon black1333-86-40.063360.200000.11905
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.267204.000002.38093
Non hazardousProprietary1.298884.100002.44045
Tetramethylbiphenyl diglycidyl ether85954-11-60.633602.000001.19046
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00564
Nickel (Ni)7440-02-00.2910097.000000.54676
Palladium (Pd)7440-05-30.006002.000000.01127
WirePure metalCopper (Cu)7440-50-80.10215100.000000.19194
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.