Chemical content 74HC4052D-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC4052D-Q100SOT109-1SO16162.43704 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352988441181012601235Nijmegen, Netherlands; Shanghai, China; Suzhou, China; Bangkok, Thailand; Jiangyin, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0155877.900000.00959
PolymerAcrylic resinProprietary0.0030415.200000.00187
Resin systemProprietary0.001386.900000.00085
DieDoped siliconSilicon (Si)7440-21-30.58076100.000000.35753
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-854.6301297.4700033.63157
Iron (Fe)7439-89-61.345162.400000.82811
Phosphorus (P)7723-14-00.016810.030000.01035
Zinc (Zn)7440-66-60.056050.100000.03450
Mould CompoundFillerSilica -amorphous-7631-86-90.625480.600000.38506
Silica fused60676-86-081.6566878.3300050.26974
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-86.359076.100003.91479
PigmentCarbon black1333-86-40.208490.200000.12835
PolymerEpoxy resin systemProprietary9.238378.862005.68735
Phenolic resinProprietary6.158915.908003.79157
Pre-PlatingPure metal layerGold (Au)7440-57-50.042683.000000.02628
Nickel (Ni)7440-02-01.3132192.300000.80844
Palladium (Pd)7440-05-30.044113.100000.02715
Silver (Ag)7440-22-40.022761.600000.01401
WirePure metalCopper (Cu)7440-50-80.11837100.000000.07287
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.