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Chemical content 74HC4053BZ

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Type numberPackagePackage descriptionTotal product weight
74HC4053BZSOT8016-1DHXQFN166.62944 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691423115312601235Shanghai, China; Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0115060.000000.17350
ImpurityNon hazardousProprietary0.000010.039500.00011
PolymerResin systemProprietary0.0076639.951410.11553
subTotal0.01917100.000000.28914
DieDoped siliconSilicon (Si)7440-21-30.22029100.000003.32290
subTotal0.22029100.000003.32290
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-83.0022197.0000045.28600
Nickel (Ni)7440-02-00.092853.000001.40060
subTotal3.09506100.0000046.68660
Mould CompoundAdditiveNon hazardousProprietary0.093752.900001.41415
FillerSilica fused60676-86-02.8755488.9500043.37531
PigmentCarbon black1333-86-40.004850.150000.07315
PolymerEpoxy resin systemProprietary0.047521.470000.71683
Phenolic resinProprietary0.100543.110001.51655
Tetramethylbiphenyl diglycidyl ether85954-11-60.110563.420001.66772
subTotal3.23276100.0000048.76371
Pre-PlatingPure metal layerGold (Au)7440-57-50.000161.000000.00244
Nickel (Ni)7440-02-00.0147291.000000.22210
Palladium (Pd)7440-05-30.001298.000000.01953
subTotal0.01618100.000000.24407
WirePure metalCopper (Cu)7440-50-80.0444096.550000.66967
Pure metal layerGold (Au)7440-57-50.000160.350000.00243
Palladium (Pd)7440-05-30.001433.100000.02150
subTotal0.04598100.000000.69360
total6.62944100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.