Chemical content 74HC4075D

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Type numberPackagePackage descriptionTotal product weight
74HC4075DSOT108-1SO14137.10905 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9337141906531112601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, ChinaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.09659
PolymerAcrylic resinProprietary0.0258415.200000.01885
Resin systemProprietary0.011736.900000.00856
DieDoped siliconSilicon (Si)7440-21-31.41983100.000001.03555
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-847.7895497.4700034.85513
Iron (Fe)7439-89-61.176722.400000.85824
Phosphorus (P)7723-14-00.014710.030000.01073
Zinc (Zn)7440-66-60.049030.100000.03576
Mould CompoundFillerSilica -amorphous-7631-86-90.514470.600000.37522
Silica fused60676-86-067.1636778.3300048.98558
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.230416.100003.81478
PigmentCarbon black1333-86-40.171490.200000.12507
PolymerEpoxy resin systemProprietary7.598688.862005.54207
Phenolic resinProprietary5.065795.908003.69471
Pre-PlatingPure metal layerGold (Au)7440-57-50.019893.000000.01451
Nickel (Ni)7440-02-00.6119592.300000.44632
Palladium (Pd)7440-05-30.020553.100000.01499
Silver (Ag)7440-22-40.010611.600000.00774
WirePure metalCopper (Cu)7440-50-80.08172100.000000.05960
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.