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Chemical content 74HC4538PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC4538PW-Q100SOT403-1TSSOP1661.21960 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298859118712601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21632
PolymerAcrylic resinProprietary0.0258415.200000.04221
Resin systemProprietary0.011736.900000.01916
subTotal0.17000100.000000.27769
DieDoped siliconSilicon (Si)7440-21-31.04274100.000001.70328
subTotal1.04274100.000001.70328
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.54737
Iron (Fe)7439-89-60.475552.400000.77679
Phosphorus (P)7723-14-00.005940.030000.00971
Zinc (Zn)7440-66-60.019810.100000.03237
subTotal19.81448100.0000032.36624
Mould CompoundAdditiveNon hazardousProprietary1.861204.700003.04020
FillerSilica fused60676-86-031.2840079.0000051.10128
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.376006.000003.88111
PigmentCarbon black1333-86-40.079200.200000.12937
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.584004.000002.58741
Non hazardousProprietary1.623604.100002.65209
Tetramethylbiphenyl diglycidyl ether85954-11-60.792002.000001.29370
subTotal39.60000100.0000064.68516
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02465
Nickel (Ni)7440-02-00.4642592.300000.75834
Palladium (Pd)7440-05-30.015593.100000.02547
Silver (Ag)7440-22-40.008051.600000.01315
subTotal0.50298100.000000.82161
WirePure metalCopper (Cu)7440-50-80.08939100.000000.14602
subTotal0.08939100.000000.14602
total61.21960100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.