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Chemical content 74HC4851PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC4851PW-Q100SOT403-1TSSOP1667.97444 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298463118712601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.3895077.900000.57301
PolymerAcrylic resinProprietary0.0760015.200000.11181
Resin systemProprietary0.034506.900000.05075
subTotal0.50000100.000000.73557
DieDoped siliconSilicon (Si)7440-21-31.25525100.000001.84665
subTotal1.25525100.000001.84665
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-837.0386097.4700054.48901
Iron (Fe)7439-89-60.912002.400001.34168
Phosphorus (P)7723-14-00.011400.030000.01677
Zinc (Zn)7440-66-60.038000.100000.05590
subTotal38.00000100.0000055.90336
Mould CompoundAdditiveNon hazardousProprietary1.251094.700001.84053
FillerSilica fused60676-86-021.0290179.0000030.93664
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.597146.000002.34962
PigmentCarbon black1333-86-40.053240.200000.07832
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.064764.000001.56641
Non hazardousProprietary1.091384.100001.60557
Tetramethylbiphenyl diglycidyl ether85954-11-60.532382.000000.78321
subTotal26.61900100.0000039.16030
Pre-PlatingPure metal layerGold (Au)7440-57-50.045003.000000.06620
Nickel (Ni)7440-02-01.3845092.300002.03680
Palladium (Pd)7440-05-30.046503.100000.06841
Silver (Ag)7440-22-40.024001.600000.03531
subTotal1.50000100.000002.20672
WirePure metalCopper (Cu)7440-50-80.10019100.000000.14739
subTotal0.10019100.000000.14739
total67.97444100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.