Chemical content 74HC4852D-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC4852D-Q100SOT109-1SO16162.74253 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352984681181112601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0155877.900000.00957
PolymerAcrylic resinProprietary0.0030415.200000.00187
Resin systemProprietary0.001386.900000.00085
DieDoped siliconSilicon (Si)7440-21-30.89661100.000000.55094
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-854.6301297.4700033.56844
Iron (Fe)7439-89-61.345162.400000.82655
Phosphorus (P)7723-14-00.016810.030000.01033
Zinc (Zn)7440-66-60.056050.100000.03444
Mould CompoundFillerSilica -amorphous-7631-86-90.625480.600000.38434
Silica fused60676-86-081.6566878.3300050.17538
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-86.359076.100003.90744
PigmentCarbon black1333-86-40.208490.200000.12811
PolymerEpoxy resin systemProprietary9.238378.862005.67668
Phenolic resinProprietary6.158915.908003.78445
Pre-PlatingPure metal layerGold (Au)7440-57-50.042683.000000.02623
Nickel (Ni)7440-02-01.3132192.300000.80692
Palladium (Pd)7440-05-30.044113.100000.02710
Silver (Ag)7440-22-40.022761.600000.01399
WirePure metalCopper (Cu)7440-50-80.10802100.000000.06638
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.