Chemical content 74HC4852D

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Type numberPackagePackage descriptionTotal product weight
74HC4852DSOT109-1SO16143.90327 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352820881181312601235Hsin-chu, Taiwan; Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0233777.900000.01624
PolymerAcrylic resinProprietary0.0045615.200000.00317
Resin systemProprietary0.002076.900000.00144
DieDoped siliconSilicon (Si)7440-21-31.25525100.000000.87229
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-836.7218297.4700025.51841
Iron (Fe)7439-89-60.904202.400000.62834
Phosphorus (P)7723-14-00.011300.030000.00785
Zinc (Zn)7440-66-60.037680.100000.02618
Mould CompoundAdditiveNon hazardousProprietary4.900694.700003.40554
FillerSilica fused60676-86-082.3733079.0000057.24213
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-86.256206.000004.34750
PigmentCarbon black1333-86-40.208540.200000.14492
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-64.170804.000002.89834
Non hazardousProprietary4.275074.100002.97079
Tetramethylbiphenyl diglycidyl ether85954-11-62.085402.000001.44917
Pre-PlatingPure metal layerGold (Au)7440-57-50.005651.000000.00393
Nickel (Ni)7440-02-00.5480597.000000.38085
Palladium (Pd)7440-05-30.011302.000000.00785
WirePure metalCopper (Cu)7440-50-80.10802100.000000.07507
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.