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Chemical content 74HC573PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC573PW-Q100SOT360-1TSSOP2083.31266 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298865118912601235Bangkok, Thailand; Suzhou, China; Shanghai, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0311677.900000.03740
PolymerAcrylic resinProprietary0.0060815.200000.00730
Resin systemProprietary0.002766.900000.00331
subTotal0.04000100.000000.04801
DieDoped siliconSilicon (Si)7440-21-30.31140100.000000.37378
subTotal0.31140100.000000.37378
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-829.7946697.4700035.76246
Iron (Fe)7439-89-60.733632.400000.88058
Phosphorus (P)7723-14-00.009170.030000.01101
Zinc (Zn)7440-66-60.030570.100000.03669
subTotal30.56803100.0000036.69074
Mould CompoundAdditiveNon hazardousProprietary2.419564.700002.90419
FillerSilica fused60676-86-040.6692079.0000048.81515
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-83.088806.000003.70748
PigmentCarbon black1333-86-40.102960.200000.12358
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.059204.000002.47165
Non hazardousProprietary2.110684.100002.53344
Tetramethylbiphenyl diglycidyl ether85954-11-61.029602.000001.23583
subTotal51.48000100.0000061.79132
Pre-PlatingPure metal layerGold (Au)7440-57-50.023283.000000.02794
Nickel (Ni)7440-02-00.7162192.300000.85967
Palladium (Pd)7440-05-30.024053.100000.02887
Silver (Ag)7440-22-40.012421.600000.01490
subTotal0.77596100.000000.93138
WirePure metalCopper (Cu)7440-50-80.13727100.000000.16476
subTotal0.13727100.000000.16476
total83.31266100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.