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Chemical content 74HC590BQ

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Type numberPackagePackage descriptionTotal product weight
74HC590BQSOT763-1DHVQFN1621.58152 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352788341151312601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.36996
PolymerResin systemProprietary0.0198419.900000.09191
subTotal0.09968100.000000.46187
DieDoped siliconSilicon (Si)7440-21-30.52551100.000002.43499
subTotal0.52551100.000002.43499
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700037.27066
Iron (Fe)7439-89-60.198062.400000.91771
Phosphorus (P)7723-14-00.002480.030000.01147
Zinc (Zn)7440-66-60.008250.100000.03824
subTotal8.25236100.0000038.23808
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.67717
FillerSilica -amorphous-7631-86-90.434103.490002.01145
Silica fused60676-86-010.5503084.8200048.88581
PigmentCarbon black1333-86-40.019900.160000.09222
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.62246
Epoxy resin systemProprietary0.197771.590000.91639
Phenolic resinProprietary0.279872.250001.29678
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.13249
subTotal12.43846100.0000057.63477
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00971
Nickel (Ni)7440-02-00.1906391.000000.88329
Palladium (Pd)7440-05-30.016768.000000.07765
subTotal0.20948100.000000.97065
WirePure metalCopper (Cu)7440-50-80.0541096.550000.25065
Pure metal layerGold (Au)7440-57-50.000200.350000.00091
Palladium (Pd)7440-05-30.001743.100000.00805
subTotal0.05603100.000000.25961
total21.58152100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.