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Chemical content 74HC590PW

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Type numberPackagePackage descriptionTotal product weight
74HC590PWSOT403-1TSSOP1663.83823 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352788361181112601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.4005080.100000.62737
PolymerResin systemProprietary0.0995019.900000.15586
subTotal0.50000100.000000.78323
DieDoped siliconSilicon (Si)7440-21-30.73571100.000001.15246
subTotal0.73571100.000001.15246
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-837.0386097.4700058.01947
Iron (Fe)7439-89-60.912002.400001.42861
Phosphorus (P)7723-14-00.011400.030000.01786
Zinc (Zn)7440-66-60.038000.100000.05953
subTotal38.00000100.0000059.52547
Mould CompoundAdditiveNon hazardousProprietary1.081004.700001.69334
FillerSilica fused60676-86-018.1700079.0000028.46257
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.380006.000002.16171
PigmentCarbon black1333-86-40.046000.200000.07206
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.920004.000001.44114
Non hazardousProprietary0.943004.100001.47717
Tetramethylbiphenyl diglycidyl ether85954-11-60.460002.000000.72057
subTotal23.00000100.0000036.02856
Pre-PlatingPure metal layerGold (Au)7440-57-50.015001.000000.02350
Nickel (Ni)7440-02-01.4550097.000002.27920
Palladium (Pd)7440-05-30.030002.000000.04699
subTotal1.50000100.000002.34969
WirePure metalCopper (Cu)7440-50-80.10251100.000000.16058
subTotal0.10251100.000000.16058
total63.83823100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.