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Chemical content 74HC594BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC594BQ-Q100SOT763-1DHVQFN1621.63071 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691308115412601235Shanghai, China; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.36912
PolymerResin systemProprietary0.0198419.900000.09170
subTotal0.09968100.000000.46082
DieDoped siliconSilicon (Si)7440-21-30.57468100.000002.65679
subTotal0.57468100.000002.65679
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0434197.4700037.18514
Iron (Fe)7439-89-60.198052.400000.91561
Phosphorus (P)7723-14-00.002480.030000.01145
Zinc (Zn)7440-66-60.008250.100000.03815
subTotal8.25219100.0000038.15035
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.67336
FillerSilica -amorphous-7631-86-90.434103.490002.00688
Silica fused60676-86-010.5503184.8200048.77468
PigmentCarbon black1333-86-40.019900.160000.09201
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.62104
Epoxy resin systemProprietary0.197771.590000.91431
Phenolic resinProprietary0.279872.250001.29383
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.12764
subTotal12.43847100.0000057.50375
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00968
Nickel (Ni)7440-02-00.1906491.000000.88132
Palladium (Pd)7440-05-30.016768.000000.07748
subTotal0.20949100.000000.96848
WirePure metalCopper (Cu)7440-50-80.0542696.550000.25086
Pure metal layerGold (Au)7440-57-50.000200.350000.00091
Palladium (Pd)7440-05-30.001743.100000.00805
subTotal0.05620100.000000.25982
total21.63071100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.