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Chemical content 74HC594PW

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Type numberPackagePackage descriptionTotal product weight
74HC594PWSOT403-1TSSOP1660.74773 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691221118312601235Bangkok, Thailand; Nijmegen, Netherlands; Shanghai, China; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21800
PolymerAcrylic resinProprietary0.0258415.200000.04254
Resin systemProprietary0.011736.900000.01931
subTotal0.17000100.000000.27985
DieDoped siliconSilicon (Si)7440-21-30.57468100.000000.94602
subTotal0.57468100.000000.94602
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.79242
Iron (Fe)7439-89-60.475552.400000.78282
Phosphorus (P)7723-14-00.005940.030000.00979
Zinc (Zn)7440-66-60.019810.100000.03262
subTotal19.81448100.0000032.61765
Mould CompoundAdditiveNon hazardousProprietary1.861204.700003.06382
FillerSilica fused60676-86-031.2840079.0000051.49822
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.376006.000003.91126
PigmentCarbon black1333-86-40.079200.200000.13038
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.584004.000002.60750
Non hazardousProprietary1.623604.100002.67269
Tetramethylbiphenyl diglycidyl ether85954-11-60.792002.000001.30375
subTotal39.60000100.0000065.18762
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02484
Nickel (Ni)7440-02-00.4642592.300000.76423
Palladium (Pd)7440-05-30.015593.100000.02567
Silver (Ag)7440-22-40.008051.600000.01325
subTotal0.50298100.000000.82799
WirePure metalCopper (Cu)7440-50-80.08559100.000000.14089
subTotal0.08559100.000000.14089
total60.74773100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.