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Chemical content 74HC7014D-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC7014D-Q100SOT108-1SO14136.98882 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935301183118712601235Suzhou, China; Bangkok, Thailand; Nijmegen, NetherlandsLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.09667
PolymerAcrylic resinProprietary0.0258415.200000.01886
Resin systemProprietary0.011736.900000.00856
subTotal0.17000100.000000.12409
DieDoped siliconSilicon (Si)7440-21-31.29973100.000000.94879
subTotal1.29973100.000000.94879
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-847.7895497.4700034.88572
Iron (Fe)7439-89-61.176722.400000.85899
Phosphorus (P)7723-14-00.014710.030000.01074
Zinc (Zn)7440-66-60.049030.100000.03579
subTotal49.03000100.0000035.79124
Mould CompoundAdditiveNon hazardousProprietary4.029994.700002.94184
FillerSilica fused60676-86-067.7381679.0000049.44794
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.144676.000003.75554
PigmentCarbon black1333-86-40.171490.200000.12518
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.429784.000002.50369
Non hazardousProprietary3.515524.100002.56629
Tetramethylbiphenyl diglycidyl ether85954-11-61.714892.000001.25185
subTotal85.74450100.0000062.59233
Pre-PlatingPure metal layerGold (Au)7440-57-50.019893.000000.01452
Nickel (Ni)7440-02-00.6119592.300000.44671
Palladium (Pd)7440-05-30.020553.100000.01500
Silver (Ag)7440-22-40.010611.600000.00774
subTotal0.66300100.000000.48397
WirePure metalCopper (Cu)7440-50-80.08159100.000000.05956
subTotal0.08159100.000000.05956
total136.98882100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.