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Chemical content 74HC73D-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC73D-Q100SOT108-1SO14142.24602 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356911231181212601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0233777.900000.01643
PolymerAcrylic resinProprietary0.0045615.200000.00321
Resin systemProprietary0.002076.900000.00146
subTotal0.03000100.000000.02110
DieDoped siliconSilicon (Si)7440-21-30.83664100.000000.58817
subTotal0.83664100.000000.58817
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-847.7480497.4700033.56722
Iron (Fe)7439-89-61.175702.400000.82652
Phosphorus (P)7723-14-00.014700.030000.01033
Zinc (Zn)7440-66-60.048990.100000.03444
subTotal48.98742100.0000034.43851
Mould CompoundAdditiveNon hazardousProprietary4.280974.700003.00955
FillerSilica fused60676-86-071.9567679.0000050.58613
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.465076.000003.84198
PigmentCarbon black1333-86-40.182170.200000.12807
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.643384.000002.56132
Non hazardousProprietary3.734464.100002.62536
Tetramethylbiphenyl diglycidyl ether85954-11-61.821692.000001.28066
subTotal91.08450100.0000064.03307
Pre-PlatingPure metal layerGold (Au)7440-57-50.037313.000000.02623
Nickel (Ni)7440-02-01.1477892.300000.80690
Palladium (Pd)7440-05-30.038553.100000.02710
Silver (Ag)7440-22-40.019901.600000.01399
subTotal1.24353100.000000.87422
WirePure metalCopper (Cu)7440-50-80.06393100.000000.04494
subTotal0.06393100.000000.04494
total142.24602100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.