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Chemical content 74HC74D-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC74D-Q100SOT108-1SO14141.64206 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352988811187126030 s123520 s3Jiangyin, China; Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0233777.900000.01650
PolymerAcrylic resinProprietary0.0045615.200000.00322
Resin systemProprietary0.002076.900000.00146
subTotal0.03000100.000000.02118
DieDoped siliconSilicon (Si)7440-21-30.21261100.000000.15011
subTotal0.21261100.000000.15011
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-847.7480497.4700033.71035
Iron (Fe)7439-89-61.175702.400000.83005
Phosphorus (P)7723-14-00.014700.030000.01038
Zinc (Zn)7440-66-60.048990.100000.03459
subTotal48.98742100.0000034.58537
Mould CompoundFillerSilica -amorphous-7631-86-90.546510.600000.38584
Silica fused60676-86-071.3464978.3300050.37098
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.556156.100003.92267
PigmentCarbon black1333-86-40.182170.200000.12861
PolymerEpoxy resin systemProprietary8.071918.862005.69881
Phenolic resinProprietary5.381275.908003.79921
subTotal91.08450100.0000064.30612
Pre-PlatingPure metal layerGold (Au)7440-57-50.037313.000000.02634
Nickel (Ni)7440-02-01.1477892.300000.81034
Palladium (Pd)7440-05-30.038553.100000.02722
Silver (Ag)7440-22-40.019901.600000.01405
subTotal1.24353100.000000.87795
WirePure metalCopper (Cu)7440-50-80.08399100.000000.05930
subTotal0.08399100.000000.05930
total141.64206100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.