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Chemical content 74HC74PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC74PW-Q100SOT402-1TSSOP1455.90543 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298882118712601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand; Jiangyin, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.4985677.900000.89179
PolymerAcrylic resinProprietary0.0972815.200000.17401
Resin systemProprietary0.044166.900000.07899
subTotal0.64000100.000001.14479
DieDoped siliconSilicon (Si)7440-21-30.29766100.000000.53243
subTotal0.29766100.000000.53243
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-820.4687097.4700036.61308
Iron (Fe)7439-89-60.504002.400000.90152
Phosphorus (P)7723-14-00.006300.030000.01127
Zinc (Zn)7440-66-60.021000.100000.03756
subTotal21.00000100.0000037.56343
Mould CompoundAdditiveNon hazardousProprietary1.584374.700002.83402
FillerSilica fused60676-86-026.6309079.0000047.63562
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.022606.000003.61790
PigmentCarbon black1333-86-40.067420.200000.12060
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.348404.000002.41193
Non hazardousProprietary1.382114.100002.47223
Tetramethylbiphenyl diglycidyl ether85954-11-60.674202.000001.20597
subTotal33.71000100.0000060.29827
Pre-PlatingPure metal layerGold (Au)7440-57-50.005103.000000.00912
Nickel (Ni)7440-02-00.1569192.300000.28067
Palladium (Pd)7440-05-30.005273.100000.00943
Silver (Ag)7440-22-40.002721.600000.00487
subTotal0.17000100.000000.30409
WirePure metalCopper (Cu)7440-50-80.08777100.000000.15700
subTotal0.08777100.000000.15700
total55.90543100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.