Chemical content 74HC74PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC74PW-Q100SOT402-1TSSOP1459.67791 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935298882118812601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand; Jiangyin, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0155877.900000.02611
PolymerAcrylic resinProprietary0.0030415.200000.00509
Resin systemProprietary0.001386.900000.00231
DieDoped siliconSilicon (Si)7440-21-30.21261100.000000.35627
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-818.7809297.4700031.47047
Iron (Fe)7439-89-60.462442.400000.77490
Phosphorus (P)7723-14-00.005780.030000.00969
Zinc (Zn)7440-66-60.019270.100000.03229
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.39814
Silica fused60676-86-031.0186878.3300051.97682
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100004.04773
PigmentCarbon black1333-86-40.079200.200000.13271
PolymerEpoxy resin systemProprietary3.509358.862005.88049
Phenolic resinProprietary2.339575.908003.92032
Pre-PlatingPure metal layerGold (Au)7440-57-50.014673.000000.02459
Nickel (Ni)7440-02-00.4514692.300000.75649
Palladium (Pd)7440-05-30.015163.100000.02541
Silver (Ag)7440-22-40.007831.600000.01311
WirePure metalCopper (Cu)7440-50-80.08777100.000000.14707
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.