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Chemical content 74HC85PW

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Type numberPackagePackage descriptionTotal product weight
74HC85PWSOT403-1TSSOP1665.02586 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9351891801181212601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.4005080.100000.61591
PolymerResin systemProprietary0.0995019.900000.15302
subTotal0.50000100.000000.76893
DieDoped siliconSilicon (Si)7440-21-31.94785100.000002.99551
subTotal1.94785100.000002.99551
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-837.0386097.4700056.95980
Iron (Fe)7439-89-60.912002.400001.40252
Phosphorus (P)7723-14-00.011400.030000.01753
Zinc (Zn)7440-66-60.038000.100000.05844
subTotal38.00000100.0000058.43829
Mould CompoundAdditiveNon hazardousProprietary1.081004.700001.66242
FillerSilica fused60676-86-018.1700079.0000027.94273
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.380006.000002.12223
PigmentCarbon black1333-86-40.046000.200000.07074
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.920004.000001.41482
Non hazardousProprietary0.943004.100001.45019
Tetramethylbiphenyl diglycidyl ether85954-11-60.460002.000000.70741
subTotal23.00000100.0000035.37054
Pre-PlatingPure metal layerGold (Au)7440-57-50.015001.000000.02307
Nickel (Ni)7440-02-01.4550097.000002.23757
Palladium (Pd)7440-05-30.030002.000000.04614
subTotal1.50000100.000002.30678
WirePure metalCopper (Cu)7440-50-80.07800100.000000.11996
subTotal0.07800100.000000.11996
total65.02586100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.