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Chemical content 74HCT00D-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT00D-Q100SOT108-1SO14141.62055 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298902118812601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0233777.900000.01650
PolymerAcrylic resinProprietary0.0045615.200000.00322
Resin systemProprietary0.002076.900000.00146
subTotal0.03000100.000000.02118
DieDoped siliconSilicon (Si)7440-21-30.18786100.000000.13265
subTotal0.18786100.000000.13265
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-847.7480497.4700033.71547
Iron (Fe)7439-89-61.175702.400000.83017
Phosphorus (P)7723-14-00.014700.030000.01038
Zinc (Zn)7440-66-60.048990.100000.03459
subTotal48.98742100.0000034.59061
Mould CompoundAdditiveNon hazardousProprietary4.280974.700003.02285
FillerSilica fused60676-86-071.9567679.0000050.80954
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.465076.000003.85895
PigmentCarbon black1333-86-40.182170.200000.12863
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.643384.000002.57264
Non hazardousProprietary3.734464.100002.63695
Tetramethylbiphenyl diglycidyl ether85954-11-61.821692.000001.28632
subTotal91.08450100.0000064.31588
Pre-PlatingPure metal layerGold (Au)7440-57-50.037313.000000.02634
Nickel (Ni)7440-02-01.1477892.300000.81046
Palladium (Pd)7440-05-30.038553.100000.02722
Silver (Ag)7440-22-40.019901.600000.01405
subTotal1.24353100.000000.87807
WirePure metalCopper (Cu)7440-50-80.08724100.000000.06160
subTotal0.08724100.000000.06160
total141.62055100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.