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Chemical content 74HCT02BQ

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Type numberPackagePackage descriptionTotal product weight
74HCT02BQSOT762-1DHVQFN1417.93888 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352878211151212601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10386
PolymerResin systemProprietary0.0046319.900000.02580
subTotal0.02326100.000000.12966
DieDoped siliconSilicon (Si)7440-21-30.18733100.000001.04428
subTotal0.18733100.000001.04428
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.8029797.4700037.92306
Iron (Fe)7439-89-60.167512.400000.93378
Phosphorus (P)7723-14-00.002090.030000.01167
Zinc (Zn)7440-66-60.006980.100000.03891
subTotal6.97956100.0000038.90742
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.70653
FillerSilica -amorphous-7631-86-90.367153.490002.04666
Silica fused60676-86-08.9230684.8200049.74148
PigmentCarbon black1333-86-40.016830.160000.09383
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.63335
Epoxy resin systemProprietary0.167271.590000.93243
Phenolic resinProprietary0.236702.250001.31948
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.16981
subTotal10.52000100.0000058.64357
Pre-PlatingPure metal layerGold (Au)7440-57-50.001771.000000.00988
Nickel (Ni)7440-02-00.1612391.000000.89877
Palladium (Pd)7440-05-30.014178.000000.07901
subTotal0.17718100.000000.98766
WirePure metalCopper (Cu)7440-50-80.0497896.550000.27749
Pure metal layerGold (Au)7440-57-50.000180.350000.00101
Palladium (Pd)7440-05-30.001603.100000.00891
subTotal0.05156100.000000.28741
total17.93888100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.