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Chemical content 74HCT02D-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT02D-Q100SOT108-1SO14141.61839 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298724118912601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0233777.900000.01650
PolymerAcrylic resinProprietary0.0045615.200000.00322
Resin systemProprietary0.002076.900000.00146
subTotal0.03000100.000000.02118
DieDoped siliconSilicon (Si)7440-21-30.18733100.000000.13228
subTotal0.18733100.000000.13228
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-847.7480497.4700033.71599
Iron (Fe)7439-89-61.175702.400000.83019
Phosphorus (P)7723-14-00.014700.030000.01038
Zinc (Zn)7440-66-60.048990.100000.03459
subTotal48.98742100.0000034.59115
Mould CompoundAdditiveNon hazardousProprietary4.280974.700003.02289
FillerSilica fused60676-86-071.9567679.0000050.81032
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.465076.000003.85901
PigmentCarbon black1333-86-40.182170.200000.12863
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.643384.000002.57267
Non hazardousProprietary3.734464.100002.63699
Tetramethylbiphenyl diglycidyl ether85954-11-61.821692.000001.28634
subTotal91.08450100.0000064.31685
Pre-PlatingPure metal layerGold (Au)7440-57-50.037313.000000.02634
Nickel (Ni)7440-02-01.1477892.300000.81047
Palladium (Pd)7440-05-30.038553.100000.02722
Silver (Ag)7440-22-40.019901.600000.01405
subTotal1.24353100.000000.87808
WirePure metalCopper (Cu)7440-50-80.08561100.000000.06045
subTotal0.08561100.000000.06045
total141.61839100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.