Chemical content 74HCT03D

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Type numberPackagePackage descriptionTotal product weight
74HCT03DSOT108-1SO14136.30034 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9337486406531012601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.025001.000000.01834
FillerSilver (Ag)7440-22-41.8750075.000001.37564
PolymerAcrylic resinProprietary0.150006.000000.11005
Resin systemProprietary0.4500018.000000.33015
DieDoped siliconSilicon (Si)7440-21-30.42172100.000000.30940
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-863.3555097.4700046.48228
Iron (Fe)7439-89-61.560002.400001.14453
Phosphorus (P)7723-14-00.019500.030000.01431
Zinc (Zn)7440-66-60.065000.100000.04769
Mould CompoundFillerSilica -amorphous-7631-86-90.408000.600000.29934
Silica fused60676-86-053.2644078.3300039.07870
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.148006.100003.04328
PigmentCarbon black1333-86-40.136000.200000.09978
PolymerEpoxy resin systemProprietary6.026168.862004.42124
Phenolic resinProprietary4.017445.908002.94749
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00220
Nickel (Ni)7440-02-00.2910097.000000.21350
Palladium (Pd)7440-05-30.006002.000000.00440
WirePure metalCopper (Cu)7440-50-80.07863100.000000.05769
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.