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Chemical content 74HCT11PW

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Type numberPackagePackage descriptionTotal product weight
74HCT11PWSOT402-1TSSOP1456.62691 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9351863501181112601235Nijmegen, Netherlands; Shanghai, China; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.5126480.100000.90529
PolymerResin systemProprietary0.1273619.900000.22491
subTotal0.64000100.000001.13020
DieDoped siliconSilicon (Si)7440-21-30.65664100.000001.15959
subTotal0.65664100.000001.15959
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-820.4687097.4700036.14660
Iron (Fe)7439-89-60.504002.400000.89004
Phosphorus (P)7723-14-00.006300.030000.01113
Zinc (Zn)7440-66-60.021000.100000.03708
subTotal21.00000100.0000037.08485
Mould CompoundAdditiveNon hazardousProprietary1.593304.700002.81368
FillerSilica fused60676-86-026.7810079.0000047.29377
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.034006.000003.59193
PigmentCarbon black1333-86-40.067800.200000.11973
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.356004.000002.39462
Non hazardousProprietary1.389904.100002.45449
Tetramethylbiphenyl diglycidyl ether85954-11-60.678002.000001.19731
subTotal33.90000100.0000059.86553
Pre-PlatingPure metal layerGold (Au)7440-57-50.003501.000000.00618
Nickel (Ni)7440-02-00.3395097.000000.59954
Palladium (Pd)7440-05-30.007002.000000.01236
subTotal0.35000100.000000.61808
WirePure metalCopper (Cu)7440-50-80.08027100.000000.14176
subTotal0.08027100.000000.14176
total56.62691100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.