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Chemical content 74HCT138BQ

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Type numberPackagePackage descriptionTotal product weight
74HCT138BQSOT763-1DHVQFN1621.30752 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352744711151912601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.37472
PolymerResin systemProprietary0.0198419.900000.09310
subTotal0.09968100.000000.46782
DieDoped siliconSilicon (Si)7440-21-30.24383100.000001.14436
subTotal0.24383100.000001.14436
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700037.74994
Iron (Fe)7439-89-60.198062.400000.92952
Phosphorus (P)7723-14-00.002480.030000.01162
Zinc (Zn)7440-66-60.008250.100000.03873
subTotal8.25236100.0000038.72981
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.69874
FillerSilica -amorphous-7631-86-90.434103.490002.03732
Silica fused60676-86-010.5503084.8200049.51445
PigmentCarbon black1333-86-40.019900.160000.09340
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.63046
Epoxy resin systemProprietary0.197771.590000.92818
Phenolic resinProprietary0.279872.250001.31346
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.15991
subTotal12.43846100.0000058.37592
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00983
Nickel (Ni)7440-02-00.1906391.000000.89465
Palladium (Pd)7440-05-30.016768.000000.07865
subTotal0.20948100.000000.98313
WirePure metalCopper (Cu)7440-50-80.0615196.550000.28867
Pure metal layerGold (Au)7440-57-50.000220.350000.00105
Palladium (Pd)7440-05-30.001973.100000.00927
subTotal0.06371100.000000.29899
total21.30752100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.