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Chemical content 74HCT153PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT153PW-Q100SOT403-1TSSOP1667.46379 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300782118812601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.3895077.900000.57735
PolymerAcrylic resinProprietary0.0760015.200000.11265
Resin systemProprietary0.034506.900000.05114
subTotal0.50000100.000000.74114
DieDoped siliconSilicon (Si)7440-21-30.73973100.000001.09649
subTotal0.73973100.000001.09649
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-837.0386097.4700054.90145
Iron (Fe)7439-89-60.912002.400001.35184
Phosphorus (P)7723-14-00.011400.030000.01690
Zinc (Zn)7440-66-60.038000.100000.05633
subTotal38.00000100.0000056.32652
Mould CompoundAdditiveNon hazardousProprietary1.251094.700001.85447
FillerSilica fused60676-86-021.0290179.0000031.17081
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.597146.000002.36740
PigmentCarbon black1333-86-40.053240.200000.07891
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.064764.000001.57827
Non hazardousProprietary1.091384.100001.61773
Tetramethylbiphenyl diglycidyl ether85954-11-60.532382.000000.78913
subTotal26.61900100.0000039.45672
Pre-PlatingPure metal layerGold (Au)7440-57-50.045003.000000.06670
Nickel (Ni)7440-02-01.3845092.300002.05221
Palladium (Pd)7440-05-30.046503.100000.06893
Silver (Ag)7440-22-40.024001.600000.03557
subTotal1.50000100.000002.22341
WirePure metalCopper (Cu)7440-50-80.10505100.000000.15572
subTotal0.10505100.000000.15572
total67.46379100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.