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Chemical content 74HCT154BQ

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Type numberPackagePackage descriptionTotal product weight
74HCT154BQSOT815-1DHVQFN2451.00055 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352754171181212601235Nijmegen, Netherlands; Shanghai, China; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1018880.100000.19976
PolymerResin systemProprietary0.0253119.900000.04963
subTotal0.12719100.000000.24939
DieDoped siliconSilicon (Si)7440-21-31.18494100.000002.32338
subTotal1.18494100.000002.32338
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0783297.4700037.40807
Iron (Fe)7439-89-60.469762.400000.92110
Phosphorus (P)7723-14-00.005870.030000.01151
Zinc (Zn)7440-66-60.019570.100000.03838
subTotal19.57353100.0000038.37906
Mould CompoundAdditiveNon hazardousProprietary0.858522.910001.68335
FillerSilica -amorphous-7631-86-91.029633.490002.01887
Silica fused60676-86-025.0239484.8200049.06603
PigmentCarbon black1333-86-40.047200.160000.09256
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.318631.080000.62475
Epoxy resin systemProprietary0.469091.590000.91977
Phenolic resinProprietary0.663802.250001.30156
Tetramethylbiphenyl diglycidyl ether85954-11-61.091593.700002.14035
subTotal29.50241100.0000057.84724
Pre-PlatingPure metal layerGold (Au)7440-57-50.004971.000000.00974
Nickel (Ni)7440-02-00.4521491.000000.88654
Palladium (Pd)7440-05-30.039758.000000.07794
subTotal0.49686100.000000.97422
WirePure metalCopper (Cu)7440-50-80.1116396.550000.21889
Pure metal layerGold (Au)7440-57-50.000400.350000.00079
Palladium (Pd)7440-05-30.003583.100000.00703
subTotal0.11562100.000000.22671
total51.00055100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.