Chemical content 74HCT157D

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Type numberPackagePackage descriptionTotal product weight
74HCT157DSOT109-1SO16142.25049 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9337137506531212601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-42.0025080.100001.40773
PolymerResin systemProprietary0.4975019.900000.34974
DieDoped siliconSilicon (Si)7440-21-30.32683100.000000.22976
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-869.2037097.4700048.64918
Iron (Fe)7439-89-61.704002.400001.19789
Phosphorus (P)7723-14-00.021300.030000.01497
Zinc (Zn)7440-66-60.071000.100000.04991
Mould CompoundFillerSilica -amorphous-7631-86-90.408000.600000.28682
Silica fused60676-86-053.2644078.3300037.44409
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.148006.100002.91598
PigmentCarbon black1333-86-40.136000.200000.09561
PolymerEpoxy resin systemProprietary6.026168.862004.23630
Phenolic resinProprietary4.017445.908002.82420
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00211
Nickel (Ni)7440-02-00.2910097.000000.20457
Palladium (Pd)7440-05-30.006002.000000.00422
WirePure metalCopper (Cu)7440-50-80.12366100.000000.08693
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.